The Surface Analysis Team establishes national standards for advanced industries such as semiconductors and display technology through the establishment of measurement traceability, international standards and certified reference materials. The dissemination of the national standards will enhance the competitiveness of advanced industries by standardizing key fabrication process.

Current R&D Projects

• 1 Development and standardization of thickness measurement and compositional analysis methods for ultra-thin films
• 2 Development and standardization of surface analysis methods (CCQM and ISO/TC-201, etc)
• 3 Development and application of computer simulation methods for surface analysis
• 4 Surface analysis community (measurement club, symposium and training, etc)
• 5 Certified Reference Materials (multilayer, alloy and oxide thin films, etc)

Recent R&D Highlights

• Development of Measurement Method for the Absolute Thickness of Ultra-Thin Oxide Films by Medium Energy Ion Scattering Spectroscopy(MEIS) and Transmission Electron Microscopy(TEM).
• Measurement and Certification Method for the Thickness of Ultra-Thin High-K Oxide Films by Mutual Calibration Method
• Development of Uncertainty Calculation Program for the Thickness Measurement of Ultra-Thin Oxide Films by Mutual Calibration

About Other Groups

• Semiconductor Integrated Metrology Team
• Optical Imaging and Metrology Team
• Space Optics Team
• Scientific Instruments Performance Evaluation Team
• Laser Nanoprocess Equipment Team
• Atom-scale Measurement Team
• Instrumentation Infrastructure Team
• Climate Watch and Hydrogen quality Metrology Team
• Measurement Instrumentation and Data Verification Research Team