The Semiconductor Integrated Metrology Team aims to develop high-precision measurement sensors and standards technology to overcome limitations of measurement performance and improve the reliability of next-generation semiconductor manufacturing process. We have implemented many different kinds of the sensors and the performance evaluation systems, such as the real-time plasma density and nanoparticles measurements during semiconductor and display processing, the evaluation of the optical properties of thin films along with supply of thickness certification standard material, and development of the overall performance evaluation system of the vacuum pumps. Furthermore, our team provides measurement and evaluation services required for related industries, academia, and research institutions through cutting-edge technologies for semiconductor integrated instrumentation with the goal of close support to the semiconductor industry.

Current R&D Projects

• 1 Development of (flat-plate) wafer-type sensors for semiconductor process equipment diagnosis
• 2 Development of optical measurement sensors and integrated instruments for semiconductor processes
• 3 Development of high-precision measurement instrumentation for semiconductor process equipment TTTM (tool to tool matching)
• 4 Development of performance and reliability measurement technologies for material parts of semiconductor process equipment and construction of a test bed

Recent R&D Highlights

• R&D of cutting-edge technologies about semiconductor materials, components, and equipment to strengthen competitiveness, and supply technical support for industry
• Technology transfer of overall performance evaluation technology of dry vacuum pump (technology transfer KRW 140 million)
• National R&D Project of 1. the overall performance evaluation system for turbo molecular pump, high displacement dry pump and 2. the plasma material/part/equipment reliability evaluation technology development and test-bed establishment, etc.
• More than 400 cases of measurement service and technical support such as characteristics and performance evaluation of vacuum materials, components, equipment and analysis of semiconductor thin film optical properties and thickness, etc.
• Development of multi-wavelength silicon dioxide thin film thickness certification standard material served as traceable calibration of optical measuring equipment for semiconductor and display inspection.

About Other Groups

• Surface Analysis Team
• Optical Imaging and Metrology Team
• Space Optics Team
• Scientific Instruments Performance Evaluation Team
• Laser Nanoprocess Equipment Team
• Atom-scale Measurement Team
• Instrumentation Infrastructure Team
• Climate Watch and Hydrogen quality Metrology Team
• Measurement Instrumentation and Data Verification Research Team