The Length Group realizes the definition of ‘meter (m)’, the SI base unit for length, establishes, maintains, and enhances national measurement standards regarding physical quantities related to length, such as linear dimensions, angle, form, complex geometry, and various dimensional. and disseminates these standards to industries through services like calibrations, testings, and certification of certified reference materials (CRMs). Furthermore, the group focuses on establishing future measurement standards and developing cutting-edge measurement instruments and technical solutions to meet the developing needs of industries and societies of science and technology in the field of length/dimensional metrology in a timely manner.
Current R&D Projects
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1
Optical frequency stabilized laser sources
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2
High-precision linear dimension measurement technology based on laser interferometers
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3
Establishment of world-class national angle measurement system and development of calibration and testing systems
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4
Development of 2D grid coordinate/dimension measurement technology based on optical microscope or laser diffractometer
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5
Development of high-speed/large-area inspection instruments/technology for processes in semiconductor/display industry
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6
Development of multi-dimensional displacement/angle/profile measurement sensors for smart factories
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7
Long-distance/Large-size 3D profile measurement and spatial information measurement technology
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8
Development of core instrument/technology for future absolute distance measurement standards
Recent R&D Highlights
- Development of technique for simultaneously measuring thin/thick film thickness of multi-layered devices
- Simultaneous measurement of thickness/refractive index/form of silicon wafers using a spectral-domain interferometer
- Integrated certified reference material (CRM) for step-hight and roughness measurement standards
- Development of key technology for time-of-flight CMOS camera device
- Establishment of linewidth calibration system based on optical microscopy
- Development of on-machine test/calibration method for rotational stages
Introducing Teams in a Group
Length and Shape Standards Team
The Length and dimensional metrology Team maintains and enhances established measurement standards of length and related quantities, and focuses on researches to develop technologies that can meet the needs of the future society and smart factory manufacturing platforms that will be realized through the convergence of advanced industrial technologies such as artificial intelligence, virtual/augmented reality, IoT sensors, hyper-connectivity, and autonomous driving. Examples of such researches include “novel optical image sensors for simultaneous measurement of multi-dimensional displacement/angle/surface profile”, “ToF-based 3D spatial information measurement”, as well as “on-machine performance evaluation and calibration technology”.
Key Research Area
- Development of smart vision solution for high-speed, multi-dimensional motion/position/profile measurement
- Digital code based absolute encoder sensor
- On-machine performance evaluation/on-site calibration research for precision stages and robots
- Development of large-area surface profile measurement technology/instruments based on optical image analysis
- Development of source technologies of 3D ToF camera and LiDAR for long-distance/large structure measurements
- Area of responsible measurement standards: linear dimensions (gauge blocks, step gauges, line standards, ring gauges, plug gauges, tapes, laser interferometers, EDM, etc), angle (index table, autocollimators, angle blocks, optical polygons, levels, rotary encoders, etc), form (straightness, surface flatness etc), various dimensional (geodesic baselines, CRMs for 2D dimensions etc).
Multi-scale Length Measurement Team
The Multi-scale Length Measurement Team develops core multi-scale length measurement technology spanning scale ranges from several nanometers to several meters, and performs various related applied researches. The team's research aims to establish and disseminate next-generation length/dimensional measurement standards that are crucial for advancing the competitiveness of key national industries (semiconductor/display technology) and important in establishing infrastructure of society/industry where new technologies are integrated. The team is tasked with establishing, managing, and improving measurement standards ranging from laser frequency, complex geometry and CMM. The team is also responsible for development and dissemination of CRMs for nano step height and roughness. Furthermore, the team conducts future measurement standard research and applied researches such as the development of next-generation m-level absolute distance measurement technology, ㎜-㎛ range (Si wafer, large-scale glass substrates, TSV etc.) thickness/form measurement research, and ㎚-level thin film thickness measurement research, . One of the team’s most important goals include continuously collaborating with industries to commercialize the research results.
Key Research Area
- Development of large glass substrate thickness profile measurement technology
- Development of technology to simultaneously measure thickness/refractive index/warpage of large aperture silicon wafers
- Development of spectrometers for high-sensitive/high-speed thickness measurements
- Development of commercial reference materials for step heights and surface roughness
- Development of optical comb-based absolute distance measurement technology
- Establishment of measurement standards for 3D printers and x-ray CTs
- Area of responsible measurement standards: radiations of the Mise en Pratique (frequency stabilized lasers), form (roundness), complex geometry (step height, surface roughness, CMM) and CRMs (nano step height/thickness)
About Other Groups
